6G Fluorinated PI

Cat No:ELFM-0198

Description

High-performance fluorinated polyimide filament optimized for 3D printing flexible 5G/6G circuit substrates with ultra-low dielectric loss.

Datasheet

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Basic Information

Material Base	Fluorinated Polyimide
Primary Function	Flex PCB
Volume Resistivity	> 10^17 Ω·cm
Dielectric Constant	2.4 @ 40GHz
Dissipation Factor	0.0012
Tensile Strength	120 MPa
Flexural Modulus	3,100 MPa
Elongation @ Break	0.45
Glass Transition (Tg)	285°C
Heat Deflection Temp	250°C
Melting Point	N/A
Density	1.42 g/cm³
Diameter/Form	1.75mm
Printing Temp	370-405°C
Build Plate Temp	140°C
Layer Resolution	0.10mm
Thermal Conductivity	0.22 W/m·K
Shore Hardness	88D
Viscosity	N/A
UV Wavelength	N/A
Moisture Absorption	< 0.05%
Surface Finish	Glossy Amber
Print Speed	20-35 mm/s
Nozzle Type	Hardened Steel
Shelf Life	36 Months

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For Research or Industrial Raw Materials, Not For Personal Medical Use!

Eata 3DPrint: Your innovation partner for advanced 3D printing solutions, delivering cutting-edge services and materials to transform industries and drive progress.

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