Acidic Copper Sulfate Plating Base

Cat No:PPFM-0088

Description

A high-purity chemical raw material solution used for depositing the primary conductive copper layer onto 3D printed polymer parts during the metallization process.

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Basic Information

Material State	Liquid
Color	Bright Blue
Viscosity (cP)	1.2
Density (g/cm³)	1.16
Application Method	Electroless Bath
Curing Mechanism	Chemical Redox
Surface Tension (mN/m)	68
Thermal Stability	N/A
Shore Hardness	N/A
Contact Angle (Water)	N/A
Solubility	Water
Flash Point	Non-flammable
Shelf Life	12 Months
Storage Temp	15-30°C
Tensile Strength	N/A
Flexural Modulus	N/A
Elongation at Break	N/A
Refractive Index	N/A
Electrical Resistance	Conductive
Moisture Absorption	N/A
Biocompatibility	Industrial
Shrinkage Rate	N/A
Functional Group	Copper Sulfate

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For Research or Industrial Raw Materials, Not For Personal Medical Use!

Eata 3DPrint: Your innovation partner for advanced 3D printing solutions, delivering cutting-edge services and materials to transform industries and drive progress.

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