Cat No:PPFM-0029
Description
A specialized oxidant raw material used in the micro-etching process for 3D printed circuit boards and metal-infused polymers to improve surface energy and adhesion for plating.
| Material State | Aqueous Liquid |
| Color | Colorless |
| Viscosity (cP) | 1.2 |
| Density (g/cm³) | 1.26 |
| Application Method | Dip / Spray |
| Curing Mechanism | Chemical Etching |
| Surface Tension (mN/m) | 70 |
| Thermal Stability | N/A |
| Shore Hardness | N/A |
| Contact Angle (Water) | 30° |
| Solubility | Water |
| Flash Point | Non-flammable |
| Shelf Life | 12 Months |
| Storage Temp | 5-30°C |
| Tensile Strength | N/A |
| Flexural Modulus | N/A |
| Elongation at Break | N/A |
| Refractive Index | N/A |
| Electrical Resistance | Conductive |
| Moisture Absorption | N/A |
| Biocompatibility | Industrial |
| Shrinkage Rate | N/A |
| Functional Group | Inorganic Peroxide |
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For Research or Industrial Raw Materials, Not For Personal Medical Use!
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