Anisotropic Conductive Paste

Cat No:ELFM-0121

Description

Anisotropic conductive adhesive (ACA) paste for 3D dispensing, providing electrical path only in the Z-axis for high-density flip-chip and PCB bonding.

Datasheet

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Basic Information

Material Base	Epoxy / Gold Flake
Primary Function	Z-Axis Bonding
Volume Resistivity	0.005 Ω·cm (Z)
Dielectric Constant	N/A
Dissipation Factor	N/A
Tensile Strength	28 MPa
Flexural Modulus	1,600 MPa
Elongation @ Break	0.05
Glass Transition (Tg)	110°C
Heat Deflection Temp	92°C
Melting Point	N/A
Density	3.10 g/cm³
Diameter/Form	Paste
Printing Temp	N/A
Build Plate Temp	N/A
Layer Resolution	0.02mm
Thermal Conductivity	1.8 W/m·K
Shore Hardness	75D
Viscosity	62,000 cps
UV Wavelength	N/A
Moisture Absorption	< 0.2%
Surface Finish	Gold Metallic
Print Speed	N/A
Nozzle Type	Dispensing Tip
Shelf Life	6 Months

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For Research or Industrial Raw Materials, Not For Personal Medical Use!

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