| Technical Description | A specialized polyamide raw material that prevents static buildup, protecting sensitive consumer electronics during the manufacturing and assembly process. |
| Base Polymer | ESD-Safe PA6/66 |
| Density (g/cm3) | 1.16 |
| Tensile Strength (MPa) | 55 |
| Flexural Modulus (MPa) | 2400 |
| Elongation at Break (%) | 10 |
| Izod Impact Strength (J/m) | 85 |
| Glass Transition Temp (°C) | 65 |
| Melting Point (°C) | 215 |
| Printing Temp (°C) | 250 - 275 |
| Build Plate Temp (°C) | 80 - 105 |
| Thermal Conductivity (W/m⋅K) | 0.35 |
| Water Absorption (%) | 1.1 |
| Linear Mold Shrinkage (%) | 1.1 |
| Hardness (Shore D) | 78 |
| Odor Level | Neutral |
| Chemical Resistance | Excellent |
| UV Stability | Moderate |
| Transparency Level | Opaque (Black) |
| Surface Tension (mN/m) | 42 |
| Recommended Speed (mm/s) | 30 - 50 |
| Layer Resolution (mm) | 0.15 - 0.25 |
| Shelf Life (Months) | 12 |
| Raw Material Diameter (mm) | 1.75 |
| Primary Application | Tech Assembly Trays |
Eata 3DPrint: Your innovation partner for advanced 3D printing solutions, delivering cutting-edge services and materials to transform industries and drive progress.
For Research or Industrial Raw Materials, Not For Personal Medical Use!
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