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Boron-Nitride Buffer

Boron-Nitride Buffer

Cat No:SSM-0149

Description

BN-filled buffer; a chemically inert, non-stick interface for high-vacuum brazing of reactive nickel-based turbine components.

Basic Information

Base Material BN-Ceramic Composite
Solubility Method Pyrolysis
Solvent Type Vacuum Bake
Heat Deflection Temp (0.45MPa) 450+
Glass Transition Temp (Tg) -
Melting Point (°C) -
Density (g/cm³) 2.05
Water Absorption (%) 0.01
Tensile Strength (MPa) 42
Tensile Modulus (MPa) 9500
Elongation at Break (%) 0.5
Flexural Strength (MPa) 90
Flexural Modulus (MPa) 9000
Printing Temp (°C) 330-380
Bed Temp (°C) 130-160
Chamber Temp (°C) 110-150
Nozzle Type Hardened Steel
Layer Height (mm) 0.15
Shrinkage Rate (%) 0.01
Continuous Use Temp (°C) 400
Impact Strength (kJ/m²) 3.5
Flame Retardancy (UL94) V-0
Surface Resistivity (Ω) 10^15

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For Research or Industrial Raw Materials, Not For Personal Medical Use!

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