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Boron-Nitride Ceramic-Buffer

Boron-Nitride Ceramic-Buffer

Boron-Nitride Ceramic-Buffer

Cat No:SSM-0139

Description

BN-matrix support; a non-stick, non-reactive interface for high-temperature superalloy sintering and vacuum brazing processes.

Basic Information

Base Material BN-Ceramic
Solubility Method Pyrolysis
Solvent Type Thermal
Heat Deflection Temp (0.45MPa) 450+
Glass Transition Temp (Tg) -
Melting Point (°C) -
Density (g/cm³) 2.05
Water Absorption (%) 0.01
Tensile Strength (MPa) 42
Tensile Modulus (MPa) 9200
Elongation at Break (%) 0.5
Flexural Strength (MPa) 90
Flexural Modulus (MPa) 8800
Printing Temp (°C) 330-380
Bed Temp (°C) 140-170
Chamber Temp (°C) 120-160
Nozzle Type Hardened Steel
Layer Height (mm) 0.15
Shrinkage Rate (%) 0.01
Continuous Use Temp (°C) 400
Impact Strength (kJ/m²) 3.2
Flame Retardancy (UL94) V-0
Surface Resistivity (Ω) 10^15

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For Research or Industrial Raw Materials, Not For Personal Medical Use!

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