Cat No:CRSM-0142
Description
Thermally conductive PLA composite for quick-turn prototyping of electronic cooling fins and heat sink enclosures.
| Base Material | PLA |
| Reinforcement Type | Boron Nitride Powder |
| Reinforcement Volume (%) | 0.2 |
| Density (g/cm³) | 1.35 |
| Tensile Strength (MPa) | 45 |
| Tensile Modulus (MPa) | 4500 |
| Elongation at Break (%) | 1.5 |
| Flexural Strength (MPa) | 72 |
| Flexural Modulus (MPa) | 4200 |
| Heat Deflection Temp (0.45MPa) | 65 |
| Glass Transition Temp (Tg) | 58 |
| Melting Point (°C) | 165 |
| Thermal Conductivity (W/mK) | 1.8 |
| Flame Retardancy (UL94) | HB |
| Surface Resistivity (Ω) | 10^15 |
| Water Absorption (%) | 0.1 |
| Printing Temp (°C) | 200-220 |
| Bed Temp (°C) | 50-60 |
| Chamber Temp (°C) | - |
| Fan Speed (%) | 100 |
| Nozzle Type | Stainless Steel |
| Layer Height (mm) | 0.2 |
| Shrinkage Rate (%) | 0.1 |
| Continuous Use Temp (°C) | 55 |
| Impact Strength (kJ/m²) | 5.5 |
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For Research or Industrial Raw Materials, Not For Personal Medical Use!
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