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Boron Nitride Thermal PI

Boron Nitride Thermal PI

Cat No:ELFM-0090

Description

Thermally conductive polyimide precursor for aerospace thermal management, providing extreme heat resistance and superior electrical insulation.

Basic Information

Material Base Polyimide / BN
Primary Function Aero Cooling
Volume Resistivity > 10^16 Ω·cm
Dielectric Constant 3.8 @ 1MHz
Dissipation Factor 0.008
Tensile Strength 135 MPa
Flexural Modulus 4,200 MPa
Elongation @ Break 0.4
Glass Transition (Tg) 340°C
Heat Deflection Temp 310°C
Melting Point N/A
Density 1.62 g/cm³
Diameter/Form Pellets/Ink
Printing Temp N/A
Build Plate Temp 150°C
Layer Resolution 0.02mm
Thermal Conductivity 3.5 W/m·K
Shore Hardness 90D
Viscosity 5,500 cps
UV Wavelength N/A
Moisture Absorption < 0.3%
Surface Finish Matte White
Print Speed N/A
Nozzle Type Dispensing Tip
Shelf Life 12 Months

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For Research or Industrial Raw Materials, Not For Personal Medical Use!

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