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Broadband EMI Resin

Broadband EMI Resin

Cat No:ELFM-0182

Description

Carbonyl iron and carbon nanotube loaded photopolymer designed for broadband EMI absorption and suppression in miniaturized electronic devices.

Basic Information

Material Base Resin / Carbon-Fe
Primary Function Signal Damping
Volume Resistivity 10^1 - 10^3 Ω·cm
Dielectric Constant 12.0 @ 10GHz
Dissipation Factor 0.42
Tensile Strength 52 MPa
Flexural Modulus 2,800 MPa
Elongation @ Break 0.08
Glass Transition (Tg) 110°C
Heat Deflection Temp 92°C
Melting Point N/A
Density 1.85 g/cm³
Diameter/Form Liquid
Printing Temp N/A
Build Plate Temp N/A
Layer Resolution 0.025mm
Thermal Conductivity 0.95 W/m·K
Shore Hardness 84D
Viscosity 880 cps
UV Wavelength 385-405nm
Moisture Absorption < 0.2%
Surface Finish Matte Grey
Print Speed 3.5s / layer
Nozzle Type N/A
Shelf Life 12 Months

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For Research or Industrial Raw Materials, Not For Personal Medical Use!

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