Ceramic-Filled Low-K Resin

Cat No:ELFM-0035

Description

A specialized ceramic-loaded photopolymer providing high dimensional stability and ultra-low loss for 3D printed microwave substrates and high-speed PCBs.

Datasheet

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Basic Information

Material Base	Silicate / Resin
Primary Function	High-Freq PCB
Volume Resistivity	> 10^15 Ω·cm
Dielectric Constant	3.2 @ 10GHz
Dissipation Factor	0.0015
Tensile Strength	60 MPa
Flexural Modulus	3,200 MPa
Elongation @ Break	0.035
Glass Transition (Tg)	115°C
Heat Deflection Temp	105°C
Melting Point	N/A
Density	1.45 g/cm³
Diameter/Form	Liquid
Printing Temp	N/A
Build Plate Temp	N/A
Layer Resolution	0.05mm
Thermal Conductivity	0.85 W/m·K
Shore Hardness	85D
Viscosity	800 cps
UV Wavelength	385-405nm
Moisture Absorption	< 0.05%
Surface Finish	Matte Grey
Print Speed	4s / layer
Nozzle Type	N/A
Shelf Life	12 Months

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