Cat No:SSM-0066
Description
Ultra-conductive breakaway support providing ESD protection for sensitive electronics during the printing build process.
| Base Material | CNT-Filled Matrix |
| Solubility Method | Mechanical |
| Solvent Type | None |
| Heat Deflection Temp (0.45MPa) | 130 |
| Glass Transition Temp (Tg) | 140 |
| Melting Point (°C) | 270 |
| Density (g/cm³) | 1.28 |
| Water Absorption (%) | 0.05 |
| Tensile Strength (MPa) | 65 |
| Tensile Modulus (MPa) | 7500 |
| Elongation at Break (%) | 2 |
| Flexural Strength (MPa) | 115 |
| Flexural Modulus (MPa) | 7000 |
| Printing Temp (°C) | 280-310 |
| Bed Temp (°C) | 100-130 |
| Chamber Temp (°C) | 90-120 |
| Nozzle Type | Hardened Steel |
| Layer Height (mm) | 0.15 |
| Shrinkage Rate (%) | 0.15 |
| Continuous Use Temp (°C) | 120 |
| Impact Strength (kJ/m²) | 9 |
| Flame Retardancy (UL94) | V-0 |
| Surface Resistivity (Ω) | 10^2 |
Eata 3DPrint: Your innovation partner for advanced 3D printing solutions, delivering cutting-edge services and materials to transform industries and drive progress.
For Research or Industrial Raw Materials, Not For Personal Medical Use!
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Eata 3DPrint: Your innovation partner for advanced 3D printing solutions, delivering cutting-edge services and materials to transform industries and drive progress.
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