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Conductive Epoxy-Si

Conductive Epoxy-Si

Cat No:ELFM-0211

Description

High-conductivity silver-CNT hybrid epoxy for 3D dispensing, designed for SMT component attachment and thermally conductive electrical paths.

Basic Information

Material Base Epoxy / Silver-CNT
Primary Function SMT Adhesive
Volume Resistivity < 0.005 Ω·cm
Dielectric Constant N/A
Dissipation Factor N/A
Tensile Strength 42 MPa
Flexural Modulus 3,200 MPa
Elongation @ Break 0.02
Glass Transition (Tg) 135°C
Heat Deflection Temp 115°C
Melting Point N/A
Density 2.55 g/cm³
Diameter/Form Paste/Ink
Printing Temp N/A
Build Plate Temp 120°C
Layer Resolution 0.01mm
Thermal Conductivity 3.5 W/m·K
Shore Hardness 85D
Viscosity 58,000 cps
UV Wavelength N/A
Moisture Absorption < 0.1%
Surface Finish Metallic Silver
Print Speed N/A
Nozzle Type Dispensing Tip
Shelf Life 6 Months

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For Research or Industrial Raw Materials, Not For Personal Medical Use!

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