Cat No:ELFM-0211
Description
High-conductivity silver-CNT hybrid epoxy for 3D dispensing, designed for SMT component attachment and thermally conductive electrical paths.
| Material Base | Epoxy / Silver-CNT |
| Primary Function | SMT Adhesive |
| Volume Resistivity | < 0.005 Ω·cm |
| Dielectric Constant | N/A |
| Dissipation Factor | N/A |
| Tensile Strength | 42 MPa |
| Flexural Modulus | 3,200 MPa |
| Elongation @ Break | 0.02 |
| Glass Transition (Tg) | 135°C |
| Heat Deflection Temp | 115°C |
| Melting Point | N/A |
| Density | 2.55 g/cm³ |
| Diameter/Form | Paste/Ink |
| Printing Temp | N/A |
| Build Plate Temp | 120°C |
| Layer Resolution | 0.01mm |
| Thermal Conductivity | 3.5 W/m·K |
| Shore Hardness | 85D |
| Viscosity | 58,000 cps |
| UV Wavelength | N/A |
| Moisture Absorption | < 0.1% |
| Surface Finish | Metallic Silver |
| Print Speed | N/A |
| Nozzle Type | Dispensing Tip |
| Shelf Life | 6 Months |
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For Research or Industrial Raw Materials, Not For Personal Medical Use!
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