Conductive PAI Ink

Cat No:ELFM-0280

Description

Silver-filled Polyamide-imide (PAI) ink for 3D dispensing of circuit traces that operate continuously at 275°C in jet engine control units.

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Basic Information

Material Base	PAI / Silver Flake
Primary Function	Extreme PCB
Volume Resistivity	< 0.005 Ω·cm
Dielectric Constant	N/A
Dissipation Factor	N/A
Tensile Strength	105 MPa
Flexural Modulus	3,800 MPa
Elongation @ Break	0.05
Glass Transition (Tg)	280°C
Heat Deflection Temp	275°C
Melting Point	N/A
Density	2.65 g/cm³
Diameter/Form	Paste/Ink
Printing Temp	N/A
Build Plate Temp	150°C
Layer Resolution	0.01mm
Thermal Conductivity	4.5 W/m·K
Shore Hardness	92D
Viscosity	52,000 cps
UV Wavelength	N/A
Moisture Absorption	< 0.2%
Surface Finish	Silver Metallic
Print Speed	N/A
Nozzle Type	Precision Tip
Shelf Life	6 Months

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For Research or Industrial Raw Materials, Not For Personal Medical Use!

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