Cat No:SSM-0160
Description
Conductive PEEK support for aerospace ESD safety; provides structural rigidity while preventing charge build-up during printing.
| Base Material | CNT-PEEK Matrix |
| Solubility Method | Mechanical |
| Solvent Type | None |
| Heat Deflection Temp (0.45MPa) | 260 |
| Glass Transition Temp (Tg) | 275 |
| Melting Point (°C) | 340 |
| Density (g/cm³) | 1.36 |
| Water Absorption (%) | 0.1 |
| Tensile Strength (MPa) | 115 |
| Tensile Modulus (MPa) | 4500 |
| Elongation at Break (%) | 3 |
| Flexural Strength (MPa) | 185 |
| Flexural Modulus (MPa) | 4200 |
| Printing Temp (°C) | 380-420 |
| Bed Temp (°C) | 150-180 |
| Chamber Temp (°C) | 140-170 |
| Nozzle Type | Hardened Steel |
| Layer Height (mm) | 0.15 |
| Shrinkage Rate (%) | 0.1 |
| Continuous Use Temp (°C) | 240 |
| Impact Strength (kJ/m²) | 14 |
| Flame Retardancy (UL94) | V-0 |
| Surface Resistivity (Ω) | 10^1 |
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For Research or Industrial Raw Materials, Not For Personal Medical Use!
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