Copper-Carbon Paste

Cat No:ELFM-0137

Description

A hybrid copper and carbon nanotube paste for 3D dispensing, providing cost-effective EMI shielding and grounding for complex enclosures.

Datasheet

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Basic Information

Material Base	Epoxy / Cu-CNT
Primary Function	EMI Gasket
Volume Resistivity	< 0.1 Ω·cm
Dielectric Constant	N/A
Dissipation Factor	N/A
Tensile Strength	25 MPa
Flexural Modulus	1,400 MPa
Elongation @ Break	0.1
Glass Transition (Tg)	105°C
Heat Deflection Temp	85°C
Melting Point	N/A
Density	2.45 g/cm³
Diameter/Form	Paste
Printing Temp	N/A
Build Plate Temp	N/A
Layer Resolution	0.05mm
Thermal Conductivity	1.8 W/m·K
Shore Hardness	75A
Viscosity	48,000 cps
UV Wavelength	N/A
Moisture Absorption	< 0.2%
Surface Finish	Dark Bronze
Print Speed	N/A
Nozzle Type	Dispensing Tip
Shelf Life	6 Months

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For Research or Industrial Raw Materials, Not For Personal Medical Use!

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