Copper-Filled EMI Paste

Cat No:ELFM-0089

Description

A high-viscosity copper-filled conductive paste for 3D extrusion, used as a cost-effective alternative to silver for EMI shielding and grounding.

Datasheet

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Basic Information

Material Base	Epoxy / Copper
Primary Function	Low-Cost Shielding
Volume Resistivity	0.05 Ω·cm
Dielectric Constant	N/A
Dissipation Factor	N/A
Tensile Strength	32 MPa
Flexural Modulus	2,100 MPa
Elongation @ Break	0.025
Glass Transition (Tg)	110°C
Heat Deflection Temp	95°C
Melting Point	N/A
Density	2.95 g/cm³
Diameter/Form	Paste
Printing Temp	N/A
Build Plate Temp	N/A
Layer Resolution	0.05mm
Thermal Conductivity	2.2 W/m·K
Shore Hardness	82D
Viscosity	48,000 cps
UV Wavelength	N/A
Moisture Absorption	< 0.2%
Surface Finish	Metallic Copper
Print Speed	N/A
Nozzle Type	Dispensing Tip
Shelf Life	6 Months

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For Research or Industrial Raw Materials, Not For Personal Medical Use!

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