Cat No:CRSM-0071
Description
High-load copper composite providing thermal management and electromagnetic interference (EMI) shielding properties for electronic research enclosures.
| Base Material | PETG |
| Reinforcement Type | Fine Copper Powder |
| Reinforcement Volume (%) | 0.65 |
| Density (g/cm³) | 2.85 |
| Tensile Strength (MPa) | 38 |
| Tensile Modulus (MPa) | 3200 |
| Elongation at Break (%) | 5 |
| Flexural Strength (MPa) | 62 |
| Flexural Modulus (MPa) | 2950 |
| Heat Deflection Temp (0.45MPa) | 75 |
| Glass Transition Temp (Tg) | 80 |
| Melting Point (°C) | 235 |
| Thermal Conductivity (W/mK) | 2.5 |
| Flame Retardancy (UL94) | HB |
| Surface Resistivity (Ω) | 10^2 |
| Water Absorption (%) | 0.15 |
| Printing Temp (°C) | 235-265 |
| Bed Temp (°C) | 75-95 |
| Chamber Temp (°C) | - |
| Fan Speed (%) | 30 |
| Nozzle Type | Hardened Steel |
| Layer Height (mm) | 0.2 |
| Shrinkage Rate (%) | 0.4 |
| Continuous Use Temp (°C) | 70 |
| Impact Strength (kJ/m²) | 8.5 |
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For Research or Industrial Raw Materials, Not For Personal Medical Use!
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