Copper Nanoparticle Plating Ink

Cat No:PPFM-0056

Description

A high-conductivity raw material ink containing copper nanoparticles. Used for additive metallization of 3D prints to create electromagnetic interference (EMI) shielding.

Datasheet

Inquiry

Basic Information

Material State	Liquid
Color	Copper-Red
Viscosity (cP)	8-15
Density (g/cm³)	1.15
Application Method	Inkjet / Spray
Curing Mechanism	Thermal (150°C)
Surface Tension (mN/m)	32
Thermal Stability	200°C
Shore Hardness	N/A
Contact Angle (Water)	55°
Solubility	Alcohols
Flash Point	35°C
Shelf Life	6 Months
Storage Temp	2-10°C
Tensile Strength	25 MPa
Flexural Modulus	N/A
Elongation at Break	0.1
Refractive Index	N/A
Electrical Resistance	<5 mOhm/sq
Moisture Absorption	<0.8%
Biocompatibility	Industrial
Shrinkage Rate	<2.0%
Functional Group	Copper Nano

GET IT!

Eata 3DPrint: Your innovation partner for advanced 3D printing solutions, delivering cutting-edge services and materials to transform industries and drive progress.

For Research or Industrial Raw Materials, Not For Personal Medical Use!

Eata 3DPrint: Your innovation partner for advanced 3D printing solutions, delivering cutting-edge services and materials to transform industries and drive progress.

Quick Links

Subscribe to Our Newsletter

Top