Copper-PLA Paste

Cat No:ELFM-0173

Description

Nano-copper filled thermoplastic paste for precision 3D dispensing, providing low-cost, high-conductivity paths for PCB rapid prototyping.

Datasheet

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Basic Information

Material Base	PLA / Copper Nano
Primary Function	Rapid Trace
Volume Resistivity	< 0.008 Ω·cm
Dielectric Constant	N/A
Dissipation Factor	N/A
Tensile Strength	30 MPa
Flexural Modulus	2,100 MPa
Elongation @ Break	0.03
Glass Transition (Tg)	60°C
Heat Deflection Temp	55°C
Melting Point	N/A
Density	2.85 g/cm³
Diameter/Form	Paste/Ink
Printing Temp	N/A
Build Plate Temp	N/A
Layer Resolution	0.02mm
Thermal Conductivity	2.1 W/m·K
Shore Hardness	82D
Viscosity	58,000 cps
UV Wavelength	N/A
Moisture Absorption	< 0.5%
Surface Finish	Metallic Bronze
Print Speed	N/A
Nozzle Type	Dispensing Tip
Shelf Life	9 Months

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For Research or Industrial Raw Materials, Not For Personal Medical Use!

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