Cat No:SSM-0158
Description
Light-curable sacrificial resin for DLP systems; allows precise complex internal voids for micro-fluidic chip manufacturing.
| Base Material | Acrylic-Polymer |
| Solubility Method | Solvent |
| Solvent Type | IPA/Acetone |
| Heat Deflection Temp (0.45MPa) | 40 |
| Glass Transition Temp (Tg) | 45 |
| Melting Point (°C) | - |
| Density (g/cm³) | 1.1 |
| Water Absorption (%) | 0.8 |
| Tensile Strength (MPa) | 25 |
| Tensile Modulus (MPa) | 1100 |
| Elongation at Break (%) | 12 |
| Flexural Strength (MPa) | 45 |
| Flexural Modulus (MPa) | 1000 |
| Printing Temp (°C) | 20-30 |
| Bed Temp (°C) | 25-40 |
| Chamber Temp (°C) | 30 |
| Nozzle Type | - |
| Layer Height (mm) | 0.02 |
| Shrinkage Rate (%) | 0.1 |
| Continuous Use Temp (°C) | 35 |
| Impact Strength (kJ/m²) | 5 |
| Flame Retardancy (UL94) | HB |
| Surface Resistivity (Ω) | 10^14 |
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For Research or Industrial Raw Materials, Not For Personal Medical Use!
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