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EUV-Resistant Resin

EUV-Resistant Resin

Cat No:ELFM-0237

Description

High-performance photopolymer with exceptional EUV and X-ray radiation resistance, designed for printing precision jigs used in semiconductor lithography.

Basic Information

Material Base Polyimide / Silica
Primary Function Lithography Jigs
Volume Resistivity > 10^16 Ω·cm
Dielectric Constant 3.4 @ 1MHz
Dissipation Factor 0.005
Tensile Strength 82 MPa
Flexural Modulus 3,800 MPa
Elongation @ Break 0.05
Glass Transition (Tg) 280°C
Heat Deflection Temp 245°C
Melting Point N/A
Density 1.45 g/cm³
Diameter/Form Liquid
Printing Temp N/A
Build Plate Temp N/A
Layer Resolution 0.01mm
Thermal Conductivity 0.45 W/m·K
Shore Hardness 88D
Viscosity 1,150 cps
UV Wavelength 355-405nm
Moisture Absorption < 0.05%
Surface Finish Glossy Amber
Print Speed 3.0s / layer
Nozzle Type N/A
Shelf Life 12 Months

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For Research or Industrial Raw Materials, Not For Personal Medical Use!

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