Cat No:ELFM-0237
Description
High-performance photopolymer with exceptional EUV and X-ray radiation resistance, designed for printing precision jigs used in semiconductor lithography.
| Material Base | Polyimide / Silica |
| Primary Function | Lithography Jigs |
| Volume Resistivity | > 10^16 Ω·cm |
| Dielectric Constant | 3.4 @ 1MHz |
| Dissipation Factor | 0.005 |
| Tensile Strength | 82 MPa |
| Flexural Modulus | 3,800 MPa |
| Elongation @ Break | 0.05 |
| Glass Transition (Tg) | 280°C |
| Heat Deflection Temp | 245°C |
| Melting Point | N/A |
| Density | 1.45 g/cm³ |
| Diameter/Form | Liquid |
| Printing Temp | N/A |
| Build Plate Temp | N/A |
| Layer Resolution | 0.01mm |
| Thermal Conductivity | 0.45 W/m·K |
| Shore Hardness | 88D |
| Viscosity | 1,150 cps |
| UV Wavelength | 355-405nm |
| Moisture Absorption | < 0.05% |
| Surface Finish | Glossy Amber |
| Print Speed | 3.0s / layer |
| Nozzle Type | N/A |
| Shelf Life | 12 Months |
Eata 3DPrint: Your innovation partner for advanced 3D printing solutions, delivering cutting-edge services and materials to transform industries and drive progress.
For Research or Industrial Raw Materials, Not For Personal Medical Use!
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