High-Conductivity PI Ink

Cat No:ELFM-0083

Description

A high-purity polyimide precursor ink loaded with silver nanowires for 3D dispensing of ultra-flexible, high-temperature resistant conductive traces.

Datasheet

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Basic Information

Material Base	Polyimide / AgNW
Primary Function	Super-Flex Circuit
Volume Resistivity	< 0.01 Ω·cm
Dielectric Constant	N/A
Dissipation Factor	N/A
Tensile Strength	145 MPa
Flexural Modulus	3,200 MPa
Elongation @ Break	0.5
Glass Transition (Tg)	350°C
Heat Deflection Temp	320°C
Melting Point	N/A
Density	1.35 g/cm³
Diameter/Form	Liquid/Ink
Printing Temp	N/A
Build Plate Temp	120°C
Layer Resolution	0.01mm
Thermal Conductivity	1.5 W/m·K
Shore Hardness	N/A
Viscosity	3,500 cps
UV Wavelength	N/A
Moisture Absorption	< 0.4%
Surface Finish	Semi-Transparent
Print Speed	N/A
Nozzle Type	Dispensing Tip
Shelf Life	6 Months

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For Research or Industrial Raw Materials, Not For Personal Medical Use!

Eata 3DPrint: Your innovation partner for advanced 3D printing solutions, delivering cutting-edge services and materials to transform industries and drive progress.

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