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High-K Dielectric Resin

High-K Dielectric Resin

Cat No:ELFM-0002

Description

High-permittivity photopolymer engineered for RF and microwave applications, enabling the fabrication of custom dielectric lenses and high-frequency substrates.

Basic Information

Material Base Acrylate Oligomer
Primary Function RF Components
Volume Resistivity > 10^14 Ω·cm
Dielectric Constant 9.2 @ 10GHz
Dissipation Factor 0.018
Tensile Strength 58 MPa
Flexural Modulus 2,950 MPa
Elongation @ Break 0.065
Glass Transition (Tg) 98°C
Heat Deflection Temp 85°C
Melting Point N/A
Density 1.22 g/cm³
Diameter/Form Liquid
Printing Temp N/A
Build Plate Temp N/A
Layer Resolution 0.025-0.1mm
Thermal Conductivity 0.24 W/m·K
Shore Hardness 84D
Viscosity 550 cps
UV Wavelength 385-405nm
Moisture Absorption < 0.2%
Surface Finish Opaque Grey
Print Speed 2.5s / layer
Nozzle Type N/A
Shelf Life 12 Months

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For Research or Industrial Raw Materials, Not For Personal Medical Use!

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