High-K Polyimide Resin

Cat No:ELFM-0075

Description

A UV-curable high-permittivity polyimide resin engineered for high-temperature RF components, custom capacitors, and dielectric lenses in satellite systems.

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Basic Information

Material Base	PI / Ceramic Fill
Primary Function	RF Capacitance
Volume Resistivity	> 10^15 Ω·cm
Dielectric Constant	12.0 @ 10GHz
Dissipation Factor	0.005
Tensile Strength	65 MPa
Flexural Modulus	3,100 MPa
Elongation @ Break	0.05
Glass Transition (Tg)	280°C
Heat Deflection Temp	250°C
Melting Point	N/A
Density	1.55 g/cm³
Diameter/Form	Liquid
Printing Temp	N/A
Build Plate Temp	N/A
Layer Resolution	0.05mm
Thermal Conductivity	0.45 W/m·K
Shore Hardness	85D
Viscosity	950 cps
UV Wavelength	385-405nm
Moisture Absorption	< 0.2%
Surface Finish	Opaque Amber
Print Speed	4.5s / layer
Nozzle Type	N/A
Shelf Life	12 Months

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For Research or Industrial Raw Materials, Not For Personal Medical Use!

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