Cat No:SSM-0012
Description
Alkaline-soluble polyamide engineered for high-temperature stability during the printing of aerospace-grade engineering thermoplastics.
| Base Material | Modified Polyamide |
| Solubility Method | Chemical |
| Solvent Type | Alkaline Solution |
| Heat Deflection Temp (0.45MPa) | 125 |
| Glass Transition Temp (Tg) | 135 |
| Melting Point (°C) | 245 |
| Density (g/cm³) | 1.16 |
| Water Absorption (%) | 12 |
| Tensile Strength (MPa) | 48 |
| Tensile Modulus (MPa) | 2500 |
| Elongation at Break (%) | 180 |
| Flexural Strength (MPa) | 75 |
| Flexural Modulus (MPa) | 2200 |
| Printing Temp (°C) | 255-285 |
| Bed Temp (°C) | 90-110 |
| Chamber Temp (°C) | 70-90 |
| Fan Speed (%) | 10 |
| Nozzle Type | Hardened Steel |
| Layer Height (mm) | 0.2 |
| Shrinkage Rate (%) | 0.3 |
| Continuous Use Temp (°C) | 115 |
| Impact Strength (kJ/m²) | 18 |
| Flame Retardancy (UL94) | HB |
| Surface Resistivity (Ω) | 10^14 |
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For Research or Industrial Raw Materials, Not For Personal Medical Use!
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