High-Temp Polyimide Ink

Cat No:ELFM-0038

Description

High-viscosity polyimide precursor ink for high-temperature flexible circuitry insulation, capable of withstanding continuous operation at 300°C.

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Basic Information

Material Base	Polyimide / Solvent
Primary Function	Flexible Dielectric
Volume Resistivity	> 10^16 Ω·cm
Dielectric Constant	3.4 @ 1MHz
Dissipation Factor	0.002
Tensile Strength	150 MPa
Flexural Modulus	3,100 MPa
Elongation @ Break	0.6
Glass Transition (Tg)	350°C
Heat Deflection Temp	320°C
Melting Point	N/A
Density	1.42 g/cm³
Diameter/Form	Liquid/Ink
Printing Temp	N/A
Build Plate Temp	N/A
Layer Resolution	0.01mm
Thermal Conductivity	0.12 W/m·K
Shore Hardness	N/A
Viscosity	3,000 cps
UV Wavelength	N/A
Moisture Absorption	< 0.5%
Surface Finish	Amber Clear
Print Speed	N/A
Nozzle Type	Dispensing Tip
Shelf Life	12 Months

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