Cat No:SSM-0136
Description
High-performance Polyimide support for space-grade PEKK; survives vacuum testing and is removed via selective alkaline etching.
| Base Material | PI-Composite Blend |
| Solubility Method | Chemical |
| Solvent Type | Strong Alkali |
| Heat Deflection Temp (0.45MPa) | 260 |
| Glass Transition Temp (Tg) | 280 |
| Melting Point (°C) | - |
| Density (g/cm³) | 1.45 |
| Water Absorption (%) | 0.3 |
| Tensile Strength (MPa) | 110 |
| Tensile Modulus (MPa) | 4000 |
| Elongation at Break (%) | 4 |
| Flexural Strength (MPa) | 190 |
| Flexural Modulus (MPa) | 3800 |
| Printing Temp (°C) | 400-430 |
| Bed Temp (°C) | 150-180 |
| Chamber Temp (°C) | 140-170 |
| Nozzle Type | Hardened Steel |
| Layer Height (mm) | 0.15 |
| Shrinkage Rate (%) | 0.1 |
| Continuous Use Temp (°C) | 240 |
| Impact Strength (kJ/m²) | 16 |
| Flame Retardancy (UL94) | V-0 |
| Surface Resistivity (Ω) | 10^16 |
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For Research or Industrial Raw Materials, Not For Personal Medical Use!
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