Cat No:SSM-0131
Description
Insulative sacrificial support for high-voltage electronics housing; prevents dielectric breakdown during the build process.
| Base Material | Alumina-Modified PES |
| Solubility Method | Chemical |
| Solvent Type | Dilute Acid |
| Heat Deflection Temp (0.45MPa) | 210 |
| Glass Transition Temp (Tg) | 225 |
| Melting Point (°C) | - |
| Density (g/cm³) | 1.4 |
| Water Absorption (%) | 0.2 |
| Tensile Strength (MPa) | 88 |
| Tensile Modulus (MPa) | 3500 |
| Elongation at Break (%) | 3 |
| Flexural Strength (MPa) | 160 |
| Flexural Modulus (MPa) | 3200 |
| Printing Temp (°C) | 380-410 |
| Bed Temp (°C) | 140-170 |
| Chamber Temp (°C) | 120-150 |
| Nozzle Type | Hardened Steel |
| Layer Height (mm) | 0.15 |
| Shrinkage Rate (%) | 0.1 |
| Continuous Use Temp (°C) | 200 |
| Impact Strength (kJ/m²) | 15 |
| Flame Retardancy (UL94) | V-0 |
| Surface Resistivity (Ω) | 10^17 |
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For Research or Industrial Raw Materials, Not For Personal Medical Use!
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