Cat No:SSM-0167
Description
High-frequency dielectric fugitive material; minimizes signal distortion during RF waveguide builds and leaves zero residue after burnout.
| Base Material | Dielectric Polymer |
| Solubility Method | Thermal |
| Solvent Type | Pyrolysis |
| Heat Deflection Temp (0.45MPa) | 120 |
| Glass Transition Temp (Tg) | 135 |
| Melting Point (°C) | 240 |
| Density (g/cm³) | 1.02 |
| Water Absorption (%) | 0.01 |
| Tensile Strength (MPa) | 35 |
| Tensile Modulus (MPa) | 1800 |
| Elongation at Break (%) | 2 |
| Flexural Strength (MPa) | 60 |
| Flexural Modulus (MPa) | 1600 |
| Printing Temp (°C) | 240-270 |
| Bed Temp (°C) | 90-110 |
| Chamber Temp (°C) | 60-90 |
| Fan Speed (%) | 20 |
| Nozzle Type | Hardened Steel |
| Layer Height (mm) | 0.15 |
| Shrinkage Rate (%) | 0.2 |
| Continuous Use Temp (°C) | 100 |
| Impact Strength (kJ/m²) | 4 |
| Flame Retardancy (UL94) | V-0 |
| Surface Resistivity (Ω) | 10^16 |
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For Research or Industrial Raw Materials, Not For Personal Medical Use!
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