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Low-Modulus Bismuth

Low-Modulus Bismuth

Cat No:SSM-0152

Description

Bismuth-alloy core for overmolding; provides high-pressure support and low-temperature extraction for delicate hollow parts.

Basic Information

Base Material Bismuth-Tin/Polymer
Solubility Method Thermal
Solvent Type Melting
Heat Deflection Temp (0.45MPa) 40
Glass Transition Temp (Tg) -
Melting Point (°C) 135
Density (g/cm³) 9.1
Water Absorption (%) 0.01
Tensile Strength (MPa) 25
Tensile Modulus (MPa) 14000
Elongation at Break (%) 0.6
Flexural Strength (MPa) 40
Flexural Modulus (MPa) 13000
Printing Temp (°C) 150-190
Bed Temp (°C) 40-60
Chamber Temp (°C) -
Fan Speed (%) 100
Nozzle Type Hardened Steel
Layer Height (mm) 0.1
Shrinkage Rate (%) 0.01
Continuous Use Temp (°C) 35
Impact Strength (kJ/m²) 1.5
Flame Retardancy (UL94) V-0
Surface Resistivity (Ω) 10^-6

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