Low-Modulus PVA-S

Name: Low-Modulus PVA-S
SKU: SSM-0104

Cat No:SSM-0104

Description

Soft, low-modulus PVA support; reduces internal part stress in delicate, fragile prints prone to cracking during cooling.

Datasheet

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Basic Information

Base Material	Soft-Structure PVA
Solubility Method	Water
Solvent Type	Cold Water
Heat Deflection Temp (0.45MPa)	55
Glass Transition Temp (Tg)	70
Melting Point (°C)	175
Density (g/cm³)	1.12
Water Absorption (%)	45
Tensile Strength (MPa)	20
Tensile Modulus (MPa)	800
Elongation at Break (%)	600
Flexural Strength (MPa)	25
Flexural Modulus (MPa)	700
Printing Temp (°C)	180-210
Bed Temp (°C)	40-60
Chamber Temp (°C)	-
Fan Speed (%)	100
Nozzle Type	Brass
Layer Height (mm)	0.25
Shrinkage Rate (%)	0.6
Continuous Use Temp (°C)	45
Impact Strength (kJ/m²)	8
Flame Retardancy (UL94)	HB
Surface Resistivity (Ω)	10^14

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For Research or Industrial Raw Materials, Not For Personal Medical Use!

Eata 3DPrint: Your innovation partner for advanced 3D printing solutions, delivering cutting-edge services and materials to transform industries and drive progress.

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