Low-Modulus Silicone Gel Raw Material

Cat No:PPFM-0090

Description

A soft, energy-absorbing silicone raw material used for the encapsulation or surface padding of 3D printed wearable devices and sensitive electronics.

Datasheet

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Basic Information

Material State	Two-Part Liquid
Color	Clear
Viscosity (cP)	1500
Density (g/cm³)	0.98
Application Method	Casting / Dip
Curing Mechanism	Addition Cure
Surface Tension (mN/m)	21
Thermal Stability	200°C
Shore Hardness	10A
Contact Angle (Water)	100°
Solubility	Hydrocarbons
Flash Point	>300°C
Shelf Life	24 Months
Storage Temp	15-30°C
Tensile Strength	3 MPa
Flexural Modulus	0.01 GPa
Elongation at Break	4
Refractive Index	1.4
Electrical Resistance	>10^14 Ohm-cm
Moisture Absorption	<0.05%
Biocompatibility	Biocompatible
Shrinkage Rate	<0.1%
Functional Group	Vinyl Siloxane

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For Research or Industrial Raw Materials, Not For Personal Medical Use!

Eata 3DPrint: Your innovation partner for advanced 3D printing solutions, delivering cutting-edge services and materials to transform industries and drive progress.

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