MXene-EMI Resin

Cat No:ELFM-0268

Description

MXene-loaded photopolymer designed for high-efficiency EMI shielding and microwave absorption in compact high-frequency electronic packaging.

Datasheet

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Basic Information

Material Base	Resin / Ti3C2 MXene
Primary Function	EMI Absorption
Volume Resistivity	< 0.1 Ω·cm
Dielectric Constant	18.0 @ 10GHz
Dissipation Factor	0.35
Tensile Strength	52 MPa
Flexural Modulus	2,800 MPa
Elongation @ Break	0.06
Glass Transition (Tg)	115°C
Heat Deflection Temp	92°C
Melting Point	N/A
Density	1.65 g/cm³
Diameter/Form	Liquid
Printing Temp	N/A
Build Plate Temp	N/A
Layer Resolution	0.025mm
Thermal Conductivity	2.5 W/m·K
Shore Hardness	85D
Viscosity	1,100 cps
UV Wavelength	385-405nm
Moisture Absorption	< 0.1%
Surface Finish	Matte Grey
Print Speed	3.5s / layer
Nozzle Type	N/A
Shelf Life	12 Months

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