Negative Expansion Resin

Cat No:ELFM-0200

Description

Photopolymer loaded with Negative Thermal Expansion (NTE) particles to counteract shrinkage and thermal stress in high-precision electronic packaging.

Datasheet

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Basic Information

Material Base	Epoxy / NTE Ceramic
Primary Function	Precision Packaging
Volume Resistivity	> 10^15 Ω·cm
Dielectric Constant	3.8 @ 1MHz
Dissipation Factor	0.015
Tensile Strength	65 MPa
Flexural Modulus	4,500 MPa
Elongation @ Break	0.025
Glass Transition (Tg)	165°C
Heat Deflection Temp	145°C
Melting Point	N/A
Density	1.85 g/cm³
Diameter/Form	Liquid
Printing Temp	N/A
Build Plate Temp	N/A
Layer Resolution	0.01mm
Thermal Conductivity	1.5 W/m·K
Shore Hardness	88D
Viscosity	1,200 cps
UV Wavelength	385-405nm
Moisture Absorption	< 0.1%
Surface Finish	Matte White
Print Speed	3.5s / layer
Nozzle Type	N/A
Shelf Life	12 Months

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