Nickel-Filled Shielding Resin

Cat No:ELFM-0079

Description

A conductive photopolymer loaded with nickel flakes for high-resolution 3D printing of EMI/RFI shielding components and conductive gaskets.

Datasheet

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Basic Information

Material Base	Resin / Ni Flake
Primary Function	EMI Enclosures
Volume Resistivity	< 1.5 Ω·cm
Dielectric Constant	N/A
Dissipation Factor	N/A
Tensile Strength	45 MPa
Flexural Modulus	2,100 MPa
Elongation @ Break	0.06
Glass Transition (Tg)	95°C
Heat Deflection Temp	82°C
Melting Point	N/A
Density	1.52 g/cm³
Diameter/Form	Liquid
Printing Temp	N/A
Build Plate Temp	N/A
Layer Resolution	0.05mm
Thermal Conductivity	1.2 W/m·K
Shore Hardness	80D
Viscosity	750 cps
UV Wavelength	405nm
Moisture Absorption	< 0.2%
Surface Finish	Silver Metallic
Print Speed	3.5s / layer
Nozzle Type	N/A
Shelf Life	6 Months

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For Research or Industrial Raw Materials, Not For Personal Medical Use!

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