Cat No:ELFM-0238
Description
Phase Change Material (PCM) filament that absorbs latent heat during melting, ideal for 3D printing thermal buffers for pulse-power electronics.
| Material Base | Paraffin / Alumina |
| Primary Function | Heat Buffering |
| Volume Resistivity | > 10^14 Ω·cm |
| Dielectric Constant | N/A |
| Dissipation Factor | N/A |
| Tensile Strength | 8 MPa |
| Flexural Modulus | 350 MPa |
| Elongation @ Break | 0.12 |
| Glass Transition (Tg) | N/A |
| Heat Deflection Temp | 55°C (Tm) |
| Melting Point | 58°C |
| Density | 1.25 g/cm³ |
| Diameter/Form | 1.75mm |
| Printing Temp | 190-210°C |
| Build Plate Temp | 45°C |
| Layer Resolution | 0.25mm |
| Thermal Conductivity | 2.5 W/m·K |
| Shore Hardness | 65D |
| Viscosity | N/A |
| UV Wavelength | N/A |
| Moisture Absorption | < 0.1% |
| Surface Finish | Matte White |
| Print Speed | 20-40 mm/s |
| Nozzle Type | Brass |
| Shelf Life | 18 Months |
Eata 3DPrint: Your innovation partner for advanced 3D printing solutions, delivering cutting-edge services and materials to transform industries and drive progress.
For Research or Industrial Raw Materials, Not For Personal Medical Use!
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Eata 3DPrint: Your innovation partner for advanced 3D printing solutions, delivering cutting-edge services and materials to transform industries and drive progress.
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