Cat No:ELFM-0168
Description
Ultra-high temperature polyimide filament with boron reinforcement, designed for 3D printing radiation-hardened satellite electronic housings.
| Material Base | Polyimide / Boron |
| Primary Function | Deep Space Shield |
| Volume Resistivity | > 10^16 Ω·cm |
| Dielectric Constant | 3.4 @ 1MHz |
| Dissipation Factor | 0.003 |
| Tensile Strength | 115 MPa |
| Flexural Modulus | 3,200 MPa |
| Elongation @ Break | 0.1 |
| Glass Transition (Tg) | 315°C |
| Heat Deflection Temp | 280°C |
| Melting Point | N/A |
| Density | 1.45 g/cm³ |
| Diameter/Form | 1.75mm |
| Printing Temp | 390-425°C |
| Build Plate Temp | 160°C |
| Layer Resolution | 0.10mm |
| Thermal Conductivity | 0.28 W/m·K |
| Shore Hardness | 90D |
| Viscosity | N/A |
| UV Wavelength | N/A |
| Moisture Absorption | < 0.2% |
| Surface Finish | Matte Orange |
| Print Speed | 15-25 mm/s |
| Nozzle Type | Hardened Steel |
| Shelf Life | 36 Months |
Eata 3DPrint: Your innovation partner for advanced 3D printing solutions, delivering cutting-edge services and materials to transform industries and drive progress.
For Research or Industrial Raw Materials, Not For Personal Medical Use!
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Eata 3DPrint: Your innovation partner for advanced 3D printing solutions, delivering cutting-edge services and materials to transform industries and drive progress.
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