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Radiation-Hardened PI

Radiation-Hardened PI

Cat No:ELFM-0168

Description

Ultra-high temperature polyimide filament with boron reinforcement, designed for 3D printing radiation-hardened satellite electronic housings.

Basic Information

Material Base Polyimide / Boron
Primary Function Deep Space Shield
Volume Resistivity > 10^16 Ω·cm
Dielectric Constant 3.4 @ 1MHz
Dissipation Factor 0.003
Tensile Strength 115 MPa
Flexural Modulus 3,200 MPa
Elongation @ Break 0.1
Glass Transition (Tg) 315°C
Heat Deflection Temp 280°C
Melting Point N/A
Density 1.45 g/cm³
Diameter/Form 1.75mm
Printing Temp 390-425°C
Build Plate Temp 160°C
Layer Resolution 0.10mm
Thermal Conductivity 0.28 W/m·K
Shore Hardness 90D
Viscosity N/A
UV Wavelength N/A
Moisture Absorption < 0.2%
Surface Finish Matte Orange
Print Speed 15-25 mm/s
Nozzle Type Hardened Steel
Shelf Life 36 Months

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For Research or Industrial Raw Materials, Not For Personal Medical Use!

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