Silver-Filled Epoxy Paste

Cat No:ELFM-0029

Description

A high-conductivity silver-filled epoxy paste for syringe-dispensing 3D systems, providing near-metallic conductivity for PCB trace repair and sensors.

Datasheet

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Basic Information

Material Base	Epoxy/Silver
Primary Function	High-Cond. Trace
Volume Resistivity	0.001 Ω·cm
Dielectric Constant	N/A
Dissipation Factor	N/A
Tensile Strength	30 MPa
Flexural Modulus	2,500 MPa
Elongation @ Break	0.02
Glass Transition (Tg)	120°C
Heat Deflection Temp	110°C
Melting Point	N/A
Density	3.50 g/cm³
Diameter/Form	Paste
Printing Temp	N/A
Build Plate Temp	N/A
Layer Resolution	0.05mm
Thermal Conductivity	2.5 W/m·K
Shore Hardness	85D
Viscosity	50,000 cps
UV Wavelength	N/A
Moisture Absorption	< 0.1%
Surface Finish	Silver Grey
Print Speed	N/A
Nozzle Type	Dispensing Tip
Shelf Life	6 Months

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For Research or Industrial Raw Materials, Not For Personal Medical Use!

Eata 3DPrint: Your innovation partner for advanced 3D printing solutions, delivering cutting-edge services and materials to transform industries and drive progress.

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