Cat No:ELFM-0014
Description
A metal-filled thermoplastic feedstock that, after debinding and sintering, results in a high-purity copper part with excellent electrical and thermal conductivity.
| Material Base | Copper/Polymer |
| Primary Function | Pure Metal Trace |
| Volume Resistivity | < 0.005 Ω·cm |
| Dielectric Constant | N/A |
| Dissipation Factor | N/A |
| Tensile Strength | 180 MPa |
| Flexural Modulus | 110,000 MPa |
| Elongation @ Break | 0.25 |
| Glass Transition (Tg) | N/A |
| Heat Deflection Temp | N/A |
| Melting Point | 1083°C |
| Density | 4.50 g/cm³ |
| Diameter/Form | 1.75mm |
| Printing Temp | 205-215°C |
| Build Plate Temp | 50-60°C |
| Layer Resolution | 0.1-0.3mm |
| Thermal Conductivity | 390 W/m·K |
| Shore Hardness | 40 (HB) |
| Viscosity | N/A |
| UV Wavelength | N/A |
| Moisture Absorption | < 0.01% |
| Surface Finish | Metallic Copper |
| Print Speed | 30 mm/s |
| Nozzle Type | Stainless Steel |
| Shelf Life | 12 Months |
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