Cat No:ELFM-0006
Description
An electrically insulating but thermally conductive polyamide composite for passive cooling of electronic components and LED heat dissipation.
| Material Base | Polyamide/Ceramic |
| Primary Function | Heat Sink |
| Volume Resistivity | > 10^13 Ω·cm |
| Dielectric Constant | 4.8 @ 1MHz |
| Dissipation Factor | 0.012 |
| Tensile Strength | 60 MPa |
| Flexural Modulus | 4,800 MPa |
| Elongation @ Break | 0.02 |
| Glass Transition (Tg) | 115°C |
| Heat Deflection Temp | 155°C |
| Melting Point | 235°C |
| Density | 1.70 g/cm³ |
| Diameter/Form | 1.75mm |
| Printing Temp | 260-290°C |
| Build Plate Temp | 110°C |
| Layer Resolution | 0.2mm |
| Thermal Conductivity | 1.8 W/m·K |
| Shore Hardness | 86D |
| Viscosity | N/A |
| UV Wavelength | N/A |
| Moisture Absorption | < 1.2% |
| Surface Finish | Matte White |
| Print Speed | 30-40 mm/s |
| Nozzle Type | Hardened Steel |
| Shelf Life | 12 Months |
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For Research or Industrial Raw Materials, Not For Personal Medical Use!
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