Cat No:EFM-0094
Description
Engineered for thermal management in electronics, this TPE features high thermal conductivity to dissipate heat from sensitive circuit components.
| Material Category | Metal-filled TPE |
| Tensile Strength | 10.5 MPa |
| Elongation at Break | 2.5 |
| Hardness (Shore) | 85A |
| Tear Strength | 38 kN/m |
| Glass Transition (Tg) | -20°C |
| Viscosity (@25°C) | N/A |
| Density | 1.65 g/cm³ |
| Water Absorption | 0.004 |
| Flexural Modulus | 45 MPa |
| Shrinkage Rate | 0.008 |
| Color Options | Grey |
| Compression Set | 0.28 |
| Resilience | 0.35 |
| Izod Impact | 12 kJ/m² |
| Melting Point | 185°C |
| Storage Temp | Room Temp |
| Curing Wavelength | N/A |
| Layer Thickness | 0.2mm |
| Solubility | Insoluble |
| Abrasion Resistance | High |
| Thermal Stability | 105°C |
| Odor Level | Low |
| Bio-compatibility | Industrial |
| Compatible Tech | FDM/FFF |
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