Thermo-Cond. Resin-BN

Cat No:ELFM-0225

Description

Boron nitride loaded photopolymer providing high thermal conductivity while remaining a total electrical insulator for 3D printed heat sinks.

Datasheet

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Basic Information

Material Base	Resin / Boron Nitride
Primary Function	Thermal Interface
Volume Resistivity	> 10^16 Ω·cm
Dielectric Constant	4.5 @ 1MHz
Dissipation Factor	0.012
Tensile Strength	58 MPa
Flexural Modulus	3,100 MPa
Elongation @ Break	0.04
Glass Transition (Tg)	135°C
Heat Deflection Temp	115°C
Melting Point	N/A
Density	1.55 g/cm³
Diameter/Form	Liquid
Printing Temp	N/A
Build Plate Temp	N/A
Layer Resolution	0.025mm
Thermal Conductivity	2.2 W/m·K
Shore Hardness	85D
Viscosity	1,150 cps
UV Wavelength	385-405nm
Moisture Absorption	< 0.1%
Surface Finish	Matte White
Print Speed	3.5s / layer
Nozzle Type	N/A
Shelf Life	12 Months

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