Thermo-Insulating PI

Cat No:ELFM-0255

Description

Silica-filled Polyimide filament providing ultra-low thermal conductivity for 3D printing heat shields for sensors in aerospace engines.

Datasheet

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Basic Information

Material Base	Polyimide / Silica
Primary Function	Thermal Barrier
Volume Resistivity	> 10^16 Ω·cm
Dielectric Constant	3.2 @ 1MHz
Dissipation Factor	0.008
Tensile Strength	95 MPa
Flexural Modulus	3,400 MPa
Elongation @ Break	0.1
Glass Transition (Tg)	315°C
Heat Deflection Temp	285°C
Melting Point	N/A
Density	1.15 g/cm³
Diameter/Form	1.75mm
Printing Temp	390-425°C
Build Plate Temp	160°C
Layer Resolution	0.15mm
Thermal Conductivity	0.08 W/m·K
Shore Hardness	92D
Viscosity	N/A
UV Wavelength	N/A
Moisture Absorption	< 0.2%
Surface Finish	Matte White
Print Speed	15-25 mm/s
Nozzle Type	Hardened Steel
Shelf Life	36 Months

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For Research or Industrial Raw Materials, Not For Personal Medical Use!

Eata 3DPrint: Your innovation partner for advanced 3D printing solutions, delivering cutting-edge services and materials to transform industries and drive progress.

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