Cat No:ELFM-0283
Description
Boron Nitride reinforced PAEK filament providing high thermal conductivity (3.5 W/m·K) and total electrical insulation for power module spacers.
| Material Base | PAEK / Boron Nitr. |
| Primary Function | Thermal Pad 3D |
| Volume Resistivity | > 10^17 Ω·cm |
| Dielectric Constant | 3.8 @ 1MHz |
| Dissipation Factor | 0.01 |
| Tensile Strength | 110 MPa |
| Flexural Modulus | 4,500 MPa |
| Elongation @ Break | 0.035 |
| Glass Transition (Tg) | 162°C |
| Heat Deflection Temp | 295°C |
| Melting Point | 340°C |
| Density | 1.58 g/cm³ |
| Diameter/Form | 1.75mm |
| Printing Temp | 380-410°C |
| Build Plate Temp | 145°C |
| Layer Resolution | 0.15mm |
| Thermal Conductivity | 3.5 W/m·K |
| Shore Hardness | 88D |
| Viscosity | N/A |
| UV Wavelength | N/A |
| Moisture Absorption | < 0.05% |
| Surface Finish | Matte White |
| Print Speed | 15-25 mm/s |
| Nozzle Type | Hardened Steel |
| Shelf Life | 36 Months |
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For Research or Industrial Raw Materials, Not For Personal Medical Use!
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