Cat No:ELFM-0017
Description
A UV-curable polyimide-silicone hybrid material providing high dielectric strength and flexibility for protective coatings and micro-electronic encapsulation.
| Material Base | Polyimide/Silicone |
| Primary Function | Dielectric Adhesive |
| Volume Resistivity | > 10^13 Ω·cm |
| Dielectric Constant | 3.2 @ 1MHz |
| Dissipation Factor | 0.015 |
| Tensile Strength | 18.2 MPa |
| Flexural Modulus | 190 MPa |
| Elongation @ Break | 1.2 |
| Glass Transition (Tg) | 45°C |
| Heat Deflection Temp | N/A |
| Melting Point | N/A |
| Density | 1.01 g/cm³ |
| Diameter/Form | Liquid |
| Printing Temp | N/A |
| Build Plate Temp | N/A |
| Layer Resolution | 0.05-0.1mm |
| Thermal Conductivity | 0.18 W/m·K |
| Shore Hardness | 60A |
| Viscosity | 2,000 cps |
| UV Wavelength | 365-405nm |
| Moisture Absorption | < 0.3% |
| Surface Finish | Clear Yellow |
| Print Speed | 4.0s / layer |
| Nozzle Type | N/A |
| Shelf Life | 6 Months |
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For Research or Industrial Raw Materials, Not For Personal Medical Use!
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