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UV-Flexible Polyimide

UV-Flexible Polyimide

Cat No:ELFM-0017

Description

A UV-curable polyimide-silicone hybrid material providing high dielectric strength and flexibility for protective coatings and micro-electronic encapsulation.

Basic Information

Material Base Polyimide/Silicone
Primary Function Dielectric Adhesive
Volume Resistivity > 10^13 Ω·cm
Dielectric Constant 3.2 @ 1MHz
Dissipation Factor 0.015
Tensile Strength 18.2 MPa
Flexural Modulus 190 MPa
Elongation @ Break 1.2
Glass Transition (Tg) 45°C
Heat Deflection Temp N/A
Melting Point N/A
Density 1.01 g/cm³
Diameter/Form Liquid
Printing Temp N/A
Build Plate Temp N/A
Layer Resolution 0.05-0.1mm
Thermal Conductivity 0.18 W/m·K
Shore Hardness 60A
Viscosity 2,000 cps
UV Wavelength 365-405nm
Moisture Absorption < 0.3%
Surface Finish Clear Yellow
Print Speed 4.0s / layer
Nozzle Type N/A
Shelf Life 6 Months

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For Research or Industrial Raw Materials, Not For Personal Medical Use!

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