Cat No:SSM-0157
Description
PEEK-blend sacrificial support that decomposes into vapor; ideal for internal channels in vacuum-sealed electronics housing.
| Base Material | PEEK/Polymer Blend |
| Solubility Method | Thermal |
| Solvent Type | Pyrolysis |
| Heat Deflection Temp (0.45MPa) | 230 |
| Glass Transition Temp (Tg) | 245 |
| Melting Point (°C) | - |
| Density (g/cm³) | 1.18 |
| Water Absorption (%) | 0.02 |
| Tensile Strength (MPa) | 48 |
| Tensile Modulus (MPa) | 2900 |
| Elongation at Break (%) | 6 |
| Flexural Strength (MPa) | 95 |
| Flexural Modulus (MPa) | 2600 |
| Printing Temp (°C) | 310-340 |
| Bed Temp (°C) | 120-150 |
| Chamber Temp (°C) | 100-140 |
| Nozzle Type | Hardened Steel |
| Layer Height (mm) | 0.2 |
| Shrinkage Rate (%) | 0.1 |
| Continuous Use Temp (°C) | 210 |
| Impact Strength (kJ/m²) | 12 |
| Flame Retardancy (UL94) | V-0 |
| Surface Resistivity (Ω) | 10^16 |
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For Research or Industrial Raw Materials, Not For Personal Medical Use!
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