| Substrate Material | Copper Foil |
| Purity (%) | ≥99.9 |
| Thickness (μm) | 10 (Substrate) |
| Width (mm) | 200 |
| Areal Density (g/m²) | 92.0 - 95.0 |
| Tensile Strength (MPa) | ≥300 |
| Elongation (%) | ≥2.0 |
| Surface Finish | Matte Carbon |
| Surface Roughness (Ra, μm) | ≤0.40 |
| Electrical Resistivity (Ω·m) | <0.05 (Surface) |
| Thermal Conductivity (W/m·K) | 380 |
| Melting Point (°C) | 1080 |
| Oxidation Resistance (Temp/Time) | 180°C / 15min |
| Coating Type | Nano-Carbon |
| Coating Thickness (μm) | 0.5 - 1.5 |
| Core ID (mm) | 76 |
| Standard Length (m) | 25 |
| Operating Voltage Range (V) | 0.0 - 1.8 |
| Application Compatibility | Silicon Anode |
| Storage Requirements | Low Humidity |
| Form Factor | Roll |
| Hydrophilic Properties | Hydrophilic Surface |
| Compliance / Grade | Research Grade |
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