High-Modulus PAI Resin
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High-Modulus PAI Resin

High-Modulus PAI Resin

Cat No:BMBB-0076

Description

A high-tensile polyamide-imide binder with a 2.5 GPa elastic modulus, specifically for physically restraining silicon expansion.

Basic Information

Appearance Amber Solution
Solid Content (%) 15 - 20
Viscosity (mPa·s) 4500 - 9000
pH Value 4.0 - 6.0
Density (g/cm³) 1.18 - 1.25
Purity (%) ≥ 99.2
Moisture Content (%) 82 (NMP)
Melting Point (°C) N/A
Decomposition Temp (°C) > 480
Molecular Weight (Mw) 150,000 - 300,000
Particle Size D50 (μm) N/A
Tensile Strength (MPa) 120 - 180
Elongation at Break (%) 5-12
Peel Strength (N/m) ≥ 35
Glass Transition Temp (°C) 280
Solvent Type NMP
Application Type Silicon Anode
Active Material Compatibility Si-Graphite
Coating Thickness (μm) 10 - 60
Drying Condition 180°C / 4h
Swelling Ratio (%) < 3
Ion Conductivity Low
Electrochemical Window (V) 0.0 - 5.1
Storage Life (Months) 12

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