High-Tensile Alloyed Copper Foil
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High-Tensile Alloyed Copper Foil

High-Tensile Alloyed Copper Foil

Cat No:BMBCC-0017

Description

Reinforced copper substrate designed to withstand the high mechanical stresses of calendering and active material expansion.

Basic Information

Substrate Material Copper Alloy
Purity (%) ≥99.5
Thickness (μm) 8
Width (mm) 300
Areal Density (g/m²) 70.0 - 72.0
Tensile Strength (MPa) 500 - 750
Elongation (%) ≥1.5
Surface Finish Matte Finish
Surface Roughness (Ra, μm) ≤0.40
Electrical Resistivity (Ω·m) 2.5 x 10⁻⁸
Thermal Conductivity (W/m·K) 320
Melting Point (°C) 1050
Oxidation Resistance (Temp/Time) 300°C / 60min
Coating Type N/A
Coating Thickness (μm) N/A
Core ID (mm) 76
Standard Length (m) 200
Operating Voltage Range (V) 0.0 - 2.5
Application Compatibility Solid-State Anode
Storage Requirements Dry Storage
Form Factor Roll
Hydrophilic Properties Mechanical Strength
Compliance / Grade Battery Grade

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